Publicaciones en colaboración con investigadores/as de École Polytechnique Fédérale de Lausanne (23)

2023

  1. HackRF + GNU Radio: A software-defined radio to teach communication theory

    International Journal of Electrical Engineering and Education, Vol. 60, Núm. 1, pp. 23-40

2019

  1. Cyber-physical systems design methodology for the prediction of symptomatic events in chronic diseases

    Complexity Challenges in Cyber Physical Systems: Using Modeling and Simulation (M&S) to Support Intelligence, Adaptation and Autonomy (wiley), pp. 223-253

2018

  1. Fast Energy Estimation Through Partial Execution of HPC Applications

    Proceedings of the International Conference on Application-Specific Systems, Architectures and Processors

2012

  1. Fast and scalable temperature-driven floorplan design in 3D MPSoCs

    LATW 2012 - 13th IEEE Latin American Test Workshop

  2. Preface

    IFIP Advances in Information and Communication Technology

  3. Through silicon via-based grid for thermal control in 3D chips

    Design Technology for Heterogeneous Embedded Systems (Springer Netherlands), pp. 303-320

2011

  1. 3D Thermal-aware floorplanner for many-core single-chip systems

    LATW 2011 - 12th IEEE Latin-American Test Workshop

  2. Adaptive task migration policies for thermal control in MPSoCs

    Lecture Notes in Electrical Engineering, Vol. 105 LNEE, pp. 83-115

  3. Thermal modeling and management of liquid-cooled 3D stacked architectures

    IFIP Advances in Information and Communication Technology

2010

  1. Adaptive task migration policies for thermal control in MPSoCs

    Proceedings - IEEE Annual Symposium on VLSI, ISVLSI 2010

  2. Energy efficiency using loop buffer based instruction memory organizations

    Proceedings of the Innovative Architecture for Future Generation High-Performance Processors and Systems

  3. Thermal modeling and analysis of 3D multi-processor chips

    Integration, the VLSI Journal, Vol. 43, Núm. 4, pp. 327-341

  4. Thermal-aware compilation for register window-based embedded processors

    IEEE Embedded Systems Letters, Vol. 2, Núm. 4, pp. 103-106

  5. Thermal-aware compilation for system-on-chip processing architectures

    Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI

2009

  1. Dynamic thermal management in 3D multicore architectures

    Proceedings -Design, Automation and Test in Europe, DATE

  2. Modeling and dynamic management of 3D multicore systems with liquid cooling

    Proceedings - 17th IFIP International Conference on Very Large Scale Integration, VLSI-SoC 2009

  3. Thermal-aware data flow analysis

    Proceedings - Design Automation Conference

  4. Through silicon via-based grid for thermal control in 3D chips

    Lecture Notes of the Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering

2008

  1. Joint hardware-software leakage minimization approach for the register file of VLIW embedded architectures

    Integration, the VLSI Journal, Vol. 41, Núm. 1, pp. 38-48

  2. Register file reliability analysis through cycle-accurate thermal emulation

    Proceedings of the Innovative Architecture for Future Generation High-Performance Processors and Systems