Thermal-aware floorplanning exploration for 3D multi-core architectures

  1. Cuesta, D.
  2. Ayala, J.
  3. Hidalgo, J.
  4. Poncino, M.
  5. Acquaviva, A.
  6. Macii, E.
Actes de conférence:
Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI

ISBN: 9781450300124

Année de publication: 2010

Pages: 99-102

Type: Communication dans un congrès

DOI: 10.1145/1785481.1785505 GOOGLE SCHOLAR