3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-tier Liquid Cooling

  1. Sridhar, Arvind
  2. Vincenzi, Alessandro
  3. Ruggiero, Martino
  4. Brunschwiler, Thomas
  5. Atienza, David
Collection de livres:
2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD)

ISSN: 1933-7760

ISBN: 978-1-4244-8192-7

Année de publication: 2010

Pages: 463-470

Congreso: IEEE and ACM International Conference on Computer-Aided Design

Type: Communication dans un congrès

DOI: 10.1109/ICCAD.2010.5653749 GOOGLE SCHOLAR
La source de données: WoS