Modelling of voids closure in the diffusion bonding process
- Alegria, J.
- Miranda, R.M.
- De Salazar, J.M.G.
- Fernandes, A.A.
ISSN: 1662-9752, 0255-5476
ISBN: 9780878493739
Argitalpen urtea: 2008
Advanced Materials Forum IV - Selected, peer reviewed papers from the IV International Materials Symposium Materiais 2007 and XIII Encontro da Sociedade Portuguesa de Materiais - SPM
Alea: 587-588
Orrialdeak: 731-735
Mota: Biltzar ekarpena