Transient Liquid Phase (TLP) diffusion bonding of a copper based shape memory alloy using silver as interlayer
- Gómez de Salazar, J.M.
- Méndez, F.J.
- Ureña, A.
- Guilemany, J.M.
- Mellor, B.G.
ISSN: 1359-6462
Year of publication: 1997
Volume: 37
Issue: 6
Pages: 861-867
Type: Article