Transient Liquid Phase (TLP) diffusion bonding of a copper based shape memory alloy using silver as interlayer
- Gómez de Salazar, J.M.
- Méndez, F.J.
- Ureña, A.
- Guilemany, J.M.
- Mellor, B.G.
ISSN: 1359-6462
Argitalpen urtea: 1997
Alea: 37
Zenbakia: 6
Orrialdeak: 861-867
Mota: Artikulua