Thermal modeling and analysis of 3D multi-processor chips

  1. Ayala, J.L.
  2. Sridhar, A.
  3. Cuesta, D.
Revue:
Integration, the VLSI Journal

ISSN: 0167-9260

Année de publication: 2010

Volumen: 43

Número: 4

Pages: 327-341

Type: Article

DOI: 10.1016/J.VLSI.2010.06.002 GOOGLE SCHOLAR
La source de données: Scopus