Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

  1. Ribes, P.
  2. Burkhardt, T.
  3. Hornaff, M.
  4. Kousar, S.
  5. Burkhardt, D.
  6. Beckert, E.
  7. Gilaberte, M.
  8. Guilhot, D.
  9. Montes, D.
  10. Galan, M.
  11. Ferrando, S.
  12. Laudisio, M.
  13. Belenguer, T.
  14. Ibarmia, S.
  15. Gallego, P.
  16. Rodríguez, J.A.
  17. Eberhardt, R.
  18. Tünnermann, A.
Actes de conférence:
Proceedings of SPIE - The International Society for Optical Engineering

ISSN: 1996-756X 0277-786X

ISBN: 9781628416435

Année de publication: 2015

Volumen: 9520

Type: Communication dans un congrès

DOI: 10.1117/12.2178373 GOOGLE SCHOLAR