Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

  1. Ribes, P.
  2. Burkhardt, T.
  3. Hornaff, M.
  4. Kousar, S.
  5. Burkhardt, D.
  6. Beckert, E.
  7. Gilaberte, M.
  8. Guilhot, D.
  9. Montes, D.
  10. Galan, M.
  11. Ferrando, S.
  12. Laudisio, M.
  13. Belenguer, T.
  14. Ibarmia, S.
  15. Gallego, P.
  16. Rodríguez, J.A.
  17. Eberhardt, R.
  18. Tünnermann, A.
Actas:
Proceedings of SPIE - The International Society for Optical Engineering

ISSN: 1996-756X 0277-786X

ISBN: 9781628416435

Ano de publicación: 2015

Volume: 9520

Tipo: Achega congreso

DOI: 10.1117/12.2178373 GOOGLE SCHOLAR