Thermal stability of copper nitride thin films: The role of nitrogen migration

  1. Gonzalez-Arrabal, R.
  2. Gordillo, N.
  3. Martin-Gonzalez, M.S.
  4. Ruiz-Bustos, R.
  5. Agulló-López, F.
Revue:
Journal of Applied Physics

ISSN: 0021-8979

Année de publication: 2010

Volumen: 107

Número: 10

Type: Article

DOI: 10.1063/1.3369450 GOOGLE SCHOLAR