Combined Symbol Error Correction and Spare Through-Silicon Vias for 3D Memories

  1. Garcia-Herrero, F.
  2. Sanchez-Macian, A.
  3. Maestro, J.A.
Revue:
IEEE Transactions on Emerging Topics in Computing

ISSN: 2168-6750

Année de publication: 2021

Volumen: 9

Número: 4

Pages: 2139-2145

Type: Article

DOI: 10.1109/TETC.2020.2965193 GOOGLE SCHOLAR