3D thermal-aware floorplanner using a MOEA approximation

  1. Cuesta, D.
  2. Risco-Martin, J.L.
  3. Ayala, J.L.
  4. Ignacio Hidalgo, J.
Revue:
Integration, the VLSI Journal

ISSN: 0167-9260

Année de publication: 2013

Volumen: 46

Número: 1

Pages: 10-21

Type: Article

DOI: 10.1016/J.VLSI.2012.04.003 GOOGLE SCHOLAR
La source de données: Scopus