Thermal modeling and management of liquid-cooled 3D stacked architectures

  1. CoŞkun, A.K.
  2. Ayala, J.L.
  3. Atienza, D.
  4. Rosing, T.S.
Book Series:
IFIP Advances in Information and Communication Technology

ISSN: 1868-4238

ISBN: 9783642231193

Year of publication: 2011

Volume: 360

Pages: 34-55

Type: Conference paper

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Data source: Scopus