Thermal modeling and management of liquid-cooled 3D stacked architectures

  1. CoŞkun, A.K.
  2. Ayala, J.L.
  3. Atienza, D.
  4. Rosing, T.S.
Liburu bilduma:
IFIP Advances in Information and Communication Technology

ISSN: 1868-4238

ISBN: 9783642231193

Argitalpen urtea: 2011

Alea: 360

Orrialdeak: 34-55

Mota: Biltzar ekarpena

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Datuen iturria: Scopus